Product Datasheet Search Results:

VK638X.pdf2 Pages, 73 KB, Scan
VK638X
Microsemi Corp.
4 A, 600 V, SILICON, BRIDGE RECTIFIER DIODE
VK638XA.pdf2 Pages, 73 KB, Scan
VK638XA
Microsemi Corp.
15 A, 600 V, SILICON, RECTIFIER DIODE
VK638XB.pdf2 Pages, 73 KB, Scan
VK638XB
Microsemi Corp.
15 A, 600 V, SILICON, RECTIFIER DIODE
VK638XC.pdf2 Pages, 73 KB, Scan
VK638XC
Microsemi Corp.
15 A, 600 V, SILICON, RECTIFIER DIODE

Product Details Search Results:

Americanmicrosemi.com/VK638X
{"Status":"Active","Diode Type":"BRIDGE RECTIFIER DIODE"}...
739 Bytes - 03:58:30, 26 November 2024
Americanmicrosemi.com/VK638XA
{"Status":"Active","Diode Type":"RECTIFIER DIODE"}...
733 Bytes - 03:58:30, 26 November 2024
Americanmicrosemi.com/VK638XB
{"Status":"Active","Diode Type":"RECTIFIER DIODE"}...
733 Bytes - 03:58:30, 26 November 2024
Americanmicrosemi.com/VK638XC
{"Status":"Active","Diode Type":"RECTIFIER DIODE"}...
733 Bytes - 03:58:30, 26 November 2024
Micro_quality_semiconductor/VK638X
{"I(FSM) Max.(A) Pk.Fwd.Sur.Cur.":"150","I(O) Max.(A) Output Current":"30","@t(w) (s) (Test Condition)":"8.3m","V(FM) Max.(V) Forward Voltage":"1.8","@I(R) (A) (Test Condition)":"2.0","@Temp. (°C) (Test Condition)":"135","V(RRM)(V) Rep.Pk.Rev. Voltage":"600","t(rr) Max.(s) Rev.Rec. Time":"200n","Package":"BR-3q","I(RM) Max.(A) Pk. Rev. Current":"5m","@I(F) (A) (Test Condition)":"1.0","Military":"N","Semiconductor Material":"Silicon","@Temp (°C) (Test Condition)":"60","@I(FM) (A) (Test Condition)":...
1022 Bytes - 03:58:30, 26 November 2024
Micro_quality_semiconductor/VK638XA
{"@Temp. (°C) (Test Condition)":"135","t(rr) Max.(s) Rev.Rec. Time":"200n","Semiconductor Material":"Silicon","I(FSM) Max.(A) Pk.Fwd.Sur.Cur.":"150","Package":"BR-3q","@Temp (°C) (Test Condition)":"60","V(FM) Max.(V) Forward Voltage":"1.8","@t(w) (s) (Test Condition)":"8.3m","V(RRM)(V) Rep.Pk.Rev. Voltage":"600","I(RM) Max.(A) Pk. Rev. Current":"5.0m","@I(F) (A) (Test Condition)":"1","@I(FM) (A) (Test Condition)":"30","I(O) Max.(A) Output Current":"30","@I(R) (A) (Test Condition)":"2"}...
1009 Bytes - 03:58:30, 26 November 2024
Micro_quality_semiconductor/VK638XB
{"@Temp. (°C) (Test Condition)":"135","t(rr) Max.(s) Rev.Rec. Time":"200n","Semiconductor Material":"Silicon","I(FSM) Max.(A) Pk.Fwd.Sur.Cur.":"150","Package":"BR-3q","@Temp (°C) (Test Condition)":"60","V(FM) Max.(V) Forward Voltage":"1.8","@t(w) (s) (Test Condition)":"8.3m","V(RRM)(V) Rep.Pk.Rev. Voltage":"600","I(RM) Max.(A) Pk. Rev. Current":"5.0m","@I(F) (A) (Test Condition)":"1","@I(FM) (A) (Test Condition)":"30","I(O) Max.(A) Output Current":"30","@I(R) (A) (Test Condition)":"2"}...
1010 Bytes - 03:58:30, 26 November 2024
Micro_quality_semiconductor/VK638XC
{"@Temp. (°C) (Test Condition)":"135","t(rr) Max.(s) Rev.Rec. Time":"200n","Semiconductor Material":"Silicon","I(FSM) Max.(A) Pk.Fwd.Sur.Cur.":"150","Package":"BR-3q","@Temp (°C) (Test Condition)":"60","V(FM) Max.(V) Forward Voltage":"1.8","@t(w) (s) (Test Condition)":"8.3m","V(RRM)(V) Rep.Pk.Rev. Voltage":"600","I(RM) Max.(A) Pk. Rev. Current":"5.0m","@I(F) (A) (Test Condition)":"1","@I(FM) (A) (Test Condition)":"30","I(O) Max.(A) Output Current":"30","@I(R) (A) (Test Condition)":"2"}...
1002 Bytes - 03:58:30, 26 November 2024
Microsemi.com/VK638X
{"Terminal Finish":"TIN LEAD","Rep Pk Reverse Voltage-Max":"600 V","Operating Temperature-Max":"135 Cel","Qualification Status":"COMMERCIAL","JESD-609 Code":"e0","Package Shape":"RECTANGULAR","Number of Phases":"1","Status":"Active","Operating Temperature-Min":"-50 Cel","Package Style":"FLANGE MOUNT","Terminal Form":"SOLDER LUG","Configuration":"BRIDGE, 4 ELEMENTS","Output Current-Max":"4 A","Non-rep Pk Forward Current-Max":"150 A","Surface Mount":"NO","Case Connection":"ISOLATED","Mfr Package Description":...
1413 Bytes - 03:58:30, 26 November 2024
Microsemi.com/VK638XA
{"Terminal Finish":"TIN LEAD","Rep Pk Reverse Voltage-Max":"600 V","Operating Temperature-Max":"135 Cel","Application":"FAST RECOVERY","Qualification Status":"COMMERCIAL","JESD-609 Code":"e0","Package Shape":"SQUARE","Additional Feature":"LEAKAGE CURRENT IS NOT AT 25 DEG C","Number of Phases":"1","Reverse Recovery Time-Max":"0.2000 \u00b5s","Status":"Active","Operating Temperature-Min":"-50 Cel","Package Style":"FLANGE MOUNT","Terminal Form":"SOLDER LUG","Forward Voltage-Max (VF)":"1.8 V","Sub Category":"Re...
1611 Bytes - 03:58:30, 26 November 2024
Microsemi.com/VK638XB
{"Terminal Finish":"TIN LEAD","Rep Pk Reverse Voltage-Max":"600 V","Operating Temperature-Max":"135 Cel","Application":"FAST RECOVERY","Qualification Status":"COMMERCIAL","JESD-609 Code":"e0","Package Shape":"SQUARE","Additional Feature":"LEAKAGE CURRENT IS NOT AT 25 DEG C","Number of Phases":"1","Reverse Recovery Time-Max":"0.2000 \u00b5s","Status":"Active","Operating Temperature-Min":"-50 Cel","Package Style":"FLANGE MOUNT","Terminal Form":"SOLDER LUG","Forward Voltage-Max (VF)":"1.8 V","Sub Category":"Re...
1609 Bytes - 03:58:30, 26 November 2024
Microsemi.com/VK638XC
{"Terminal Finish":"TIN LEAD","Rep Pk Reverse Voltage-Max":"600 V","Operating Temperature-Max":"135 Cel","Application":"FAST RECOVERY","Qualification Status":"COMMERCIAL","JESD-609 Code":"e0","Package Shape":"SQUARE","Additional Feature":"LEAKAGE CURRENT IS NOT AT 25 DEG C","Number of Phases":"1","Reverse Recovery Time-Max":"0.2000 \u00b5s","Status":"Active","Operating Temperature-Min":"-50 Cel","Package Style":"FLANGE MOUNT","Terminal Form":"SOLDER LUG","Forward Voltage-Max (VF)":"1.8 V","Sub Category":"Re...
1626 Bytes - 03:58:30, 26 November 2024

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