Product Datasheet Search Results:
36 Pages, 1335 KB, Original- CL03X104KQ3NNNC
- Samsung
- Cap Ceramic 0.1uF 6.3V X6S 10% Pad SMD 0201 105C T/R
2 Pages, 133 KB, Original- CL03X104KQ3NNNC
- Samsung [electro-mechanics]
- MLCC 0.1uF 6.3V - CL03X104KQ3NNNC
Product Details Search Results:
Samsung.com/CL03X104KQ3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X6S","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 105C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1747 Bytes - 19:38:31, 18 November 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| CL03X104KQ3NNN.pdf | 6.12 | 1 | Request |
