Product Datasheet Search Results:
4 Pages, 458 KB, Original- BAS70-T1H
- Infineon Technologies Ag
- SILICON, MIXER DIODE
Product Details Search Results:
Infineon.com/BAS70-T1H
{"Status":"ACTIVE","Terminal Finish":"MATTE TIN","Package Body Material":"CERAMIC, METAL-SEALED COFIRED","Terminal Form":"GULL WING","Package Style":"MICROWAVE","Diode Capacitance-Max":"2 pF","Diode Element Material":"SILICON","Power Dissipation Limit-Max":"0.2500 W","Number of Elements":"1","Terminal Position":"UNSPECIFIED","Diode Type":"MIXER DIODE","Package Shape":"ROUND","Configuration":"SINGLE","Technology":"SCHOTTKY","Number of Terminals":"2","Surface Mount":"Yes"}...
1145 Bytes - 20:52:58, 24 November 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| FUSE_BASES_OFAZ_BASELINE_JULY_2024.pdf | 28.15 | 1 | Request | |
| DS_DDR3_4GB_B_DIE_BASED_1_35V_RDIMM.pdf | 1.56 | 1 | Request | |
| SAMSUNG_Z_SSD_AND_SCYLLADB_DELIVERING_LOW_LATENCY_AND_MULTI_TERABYTE_CAPACITY_IN_A_PERSISTENT_DATABASE.pdf | 1.99 | 1 | Request | |
| DS_DDR3_1GB_G_DIE_BASED_VLP_RDIMM.pdf | 1.32 | 1 | Request | |
| DS_DDR3_1GB_D_DIE_BASED_RDIMM.pdf | 1.46 | 1 | Request | |
| DS_DDR3_2GB_E_DIE_BASED_RDIMM.pdf | 1.43 | 1 | Request | |
| DS_DDR3_4GB_A_DIE_BASED_1_35V_RDIMM.pdf | 1.32 | 1 | Request | |
| DS_DDR3_4GB_B_DIE_BASED_RDIMM.pdf | 1.63 | 1 | Request | |
| DS_DDR3_4GB_A_DIE_BASED_RDIMM.pdf | 1.27 | 1 | Request | |
| DS_DDR3_2GB_B_DIE_BASED_RDIMM.pdf | 1.18 | 1 | Request | |
| DS_DDR3_4GB_B_DIE_BASED_1_35V_VLP_RDIMM.pdf | 1.54 | 1 | Request | |
| DS_DDR3_2GB_C_DIE_BASED_1_35V_RDIMM.pdf | 1.54 | 1 | Request |
