199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -
199C - SEPTEMBER 1997 - REVISED APRIL 2001 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) TSSOP (PW) CERAMIC FLAT PACK (U) 0C to 70C 2.5 mV TLV2422CD -- -- TLV2422CPWLE -- - 40C to 85C 950 V 2.5 mV TLV2422AID TLV2422ID -- -- -- -- TLV2422AIPWLE -- -- -- - 40C to 125C 950 V 2.5 mV TLV2422AQD TLV2422QD -- -- -- -- -- -- -- -- - 55C to 125C 950 V 2 mV -- -- TLV2422AMFK TLV2422MFK TLV2422AMJG TLV2422MJG -- -- TLV2422AMU TLV2422MU CHIP FORM (Y) TLV2422Y The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. D OR JG PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + VDD - /GND 1 8 2 7 3 6 4 5 PW PACKAGE (TOP VIEW) VDD + 2OUT 2IN - 2IN + 1OUT 1IN- 1IN + VDD - / GND 1 2 3 4 8 7 6 5 VDD + 2OUT 2IN - 2IN + NC 1OUT NC VDD+ NC FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN - NC NC 1OUT 1IN - 1IN + VDD -