ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
U04DCKR SN74LVC1GU04DBVR SN74LVC1GU04DBVR SN74LVC1GU04DCKR SN74LVC1GU04DCKR SN74LVC2G00DCUR SN74LVC2G00DCUR SN74LVC2G02DCUR SN74LVC2G02DCUR Not available 5 5 5 5 5 8 8 8 8 6 2G04 NC7WZ04P6 SN74LVC2G04DCKR 6 2G04 NC7WZ04P6X SN74LVC2G04DCKR 6 2G07 NC7WZ07P6 SN74LVC2G07DCKR 6 Not available in tubes, use reeled DCKR 2G07 2G08 2G08 NC7WZ07P6X NC7WZ08K8 NC7WZ08K8X SN74LVC2G07DCKR SN74LVC2G08DCUR SN74LVC2G08DCUR 6 8 8 Not available in tubes, use DCUR This package Not available in tubes, use DBVR Not available in tubes, use DCKR This package Not available in tubes, use DBVR Not available in tubes, use DCKR This package Faster, slightly lower max Vcc, not available in tubes, use DBVR Faster, slightly lower max Vcc Faster, slightly lower max Vcc, not available in tubes, use DCKR Faster, slightly lower max Vcc Faster, slightly lower max Vcc, not available in tubes, use DBVR Faster, slightly lower max Vcc Faster, slightly lower max Vcc, not available in tubes, use DCKR Faster, slightly lower max
74LVC2G07DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C075, C07F, C07K, C07R) SN74LVC2G07DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C07F, C07R) SN74LVC2G07DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -
T 2012 www.ti.com ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV QFN - DRY Reel of 3000 SN74LVC2G07DBVR C07_ (4) Reel of 5000 SN74LVC2G07DRYR CV (4) Reel of 5000 SN74LVC2G07DSFR CV Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (2) (3) (4) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) QFN - DSF (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump c
T 2012 www.ti.com ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV QFN - DRY Reel of 3000 SN74LVC2G07DBVR C07_ (4) Reel of 5000 SN74LVC2G07DRYR CV (4) Reel of 5000 SN74LVC2G07DSFR CV Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (2) (3) (4) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) QFN - DSF (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump c
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
noStar - WCSP (DSBGA) 0.23-mm Large Bump - YEP Reel of 3000 SOT (SC-70) - DCK _ _ _CV_ SN74LVC2G07YEPR NanoFree - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) SOT (SOT-23) - DBV TOP-SIDE MARKING SN74LVC2G07YZPR Reel of 3000 SN74LVC2G07DBVR Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT C07_ CV_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears a
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
is powered down. ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and di
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D
ww.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y L L H Z LOGIC D