XQ17V16CC44M 2M X 8 CONFIGURATION MEMORY, 20 ns, CQCC44
From Xilinx, Inc.
Status | ACTIVE |
Access Time-Max (tACC) | 20 ns |
Memory Density | 1.68E7 deg |
Memory IC Type | CONFIGURATION MEMORY |
Memory Width | 8 |
Mfr Package Description | CERAMIC, LCC-44 |
Number of Functions | 1 |
Number of Terminals | 44 |
Number of Words | 2.10E6 words |
Number of Words Code | 2M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 125 Cel |
Operating Temperature-Min | -55 Cel |
Organization | 2M X 8 |
Package Body Material | CERAMIC, METAL-SEALED COFIRED |
Package Shape | SQUARE |
Package Style | CHIP CARRIER |
Parallel/Serial | PARALLEL/SERIAL |
Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 3 V |
Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Finish | TIN LEAD |
Terminal Form | J BEND |
Terminal Pitch | 1.27 mm |
Terminal Position | QUAD |