828-AG11D CONN IC DIP SOCKET 28POS GOLD
From TE Connectivity AMP Connectors
3D Model | 1437538-4.pdf |
Category | Connectors, Interconnects |
Contact Finish - Mating | Gold |
Contact Finish - Post | Tin-Lead |
Contact Finish Thickness - Mating | 25µin (0.63µm) |
Contact Finish Thickness - Post | 80µin (2.03µm) |
Contact Material - Mating | Copper Alloy |
Contact Material - Post | Copper Alloy |
Contact Resistance | 10 mOhm |
Current Rating | 3A |
Datasheets | 800 Series Drawing |
Family | Sockets for ICs, Transistors |
Features | Open Frame |
Housing Material | Polyester |
Material Flammability Rating | UL94 V-0 |
Mounting Type | Through Hole |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Operating Temperature | -55°C ~ 105°C |
Other Names | 1437538-4 1437538-4-ND A112162 |
Packaging | Tube |
Pitch - Mating | 0.100" (2.54mm) |
Pitch - Post | 0.100" (2.54mm) |
Product Photos | 800, AMP |
RoHS Information | 1437538-4 Statement of Compliance |
Series | 800 |
Standard Package | 17 |
Termination | Solder |
Termination Post Length | 0.125" (3.18mm) |
Type | DIP, 0.6" (15.24mm) Row Spacing |