CL31C101JHFNNNF Cap Ceramic 100pF 630V C0G 5% Pad SMD 1206 125C T/R
From SAMSUNG
Capacitance | 100(pF) |
Case Style | Ceramic Chip |
Construction | SMT Chip |
Failure Rate | Not Required |
Lead Diameter (nom) | Not Required(mm) |
Microwave Application | YES |
Mounting Style | Surface Mount |
Number of Terminals | 2 |
Operating Temp Range | -55C to 125C |
Package / Case | 1206 |
Packaging | Tape and Reel |
Product Depth (mm) | 1.6(mm) |
Product Diameter (mm) | Not Required(mm) |
Product Height (mm) | 1.25(mm) |
Product Length (mm) | 3.2(mm) |
Rad Hardened | No |
Seated Plane Height | Not Required(mm) |
Technology | STANDARD |
Temp Coeff (Dielectric) | C0G |
Termination Style | PAD |
Tolerance (+ or -) | 5% |
Voltage | 630VDC |
Wire Form | Not Required |