CL31B224KBP5PNE Cap Ceramic 0.22uF 50V X7R 10% SMD 1206 125C Embossed T/R
From SAMSUNG
| Capacitance | 220000 pF |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | Not Required |
| Mounting Style | Surface Mount |
| Operating Temp Range | -55C to 125C |
| Package / Case | 1206 |
| Packaging | Tape and Reel |
| Product Depth (mm) | 1.6 mm |
| Product Diameter (mm) | Not Required mm |
| Product Height (mm) | 1.15 mm |
| Product Length (mm) | 3.2 mm |
| Rad Hardened | No |
| Temp Coeff (Dielectric) | X7R |
| Tolerance (+ or -) | 10% |
| Voltage | 50VDC |
| Wire Form | Not Required |
