CL03C2R2CA3GNNC Cap Ceramic 2.2pF 25V C0G 0.25pF Pad SMD 0201 125C T/R
From SAMSUNG
| Capacitance | 2.2(pF) |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | Not Required |
| Lead Diameter (nom) | Not Required(mm) |
| Microwave Application | NO |
| Mounting Style | Surface Mount |
| Number of Terminals | 2 |
| Operating Temp Range | -55C to 125C |
| Package / Case | 0201 |
| Packaging | Tape and Reel |
| Product Depth (mm) | 0.3(mm) |
| Product Diameter (mm) | Not Required(mm) |
| Product Height (mm) | 0.3(mm) |
| Product Length (mm) | 0.6(mm) |
| Rad Hardened | No |
| Seated Plane Height | Not Required(mm) |
| Technology | STANDARD |
| Temp Coeff (Dielectric) | C0G |
| Termination Style | PAD |
| Tolerance (+ or -) | 0.25pF |
| Voltage | 25VDC |
| Wire Form | Not Required |
