GS8180QV18BD-200I 1M X 18 STANDARD SRAM, 2.3 ns, PBGA165
From GSI Technology
Status | ACTIVE |
Access Time-Max (tACC) | 2.3 ns |
Memory Density | 1.89E7 deg |
Memory IC Type | STANDARD SRAM |
Memory Width | 18 |
Mfr Package Description | 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
Number of Functions | 1 |
Number of Terminals | 165 |
Number of Words | 1.05E6 words |
Number of Words Code | 1M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 1M X 18 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 2.6 V |
Supply Voltage-Min (Vsup) | 2.4 V |
Supply Voltage-Nom (Vsup) | 2.5 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | NOT SPECIFIED |
Terminal Form | BALL |
Terminal Pitch | 1 mm |
Terminal Position | BOTTOM |