Product Datasheet Search Results:

CL31B225KAH4PNE.pdf1 Pages, 51 KB, Original
CL31B225KAH4PNE
Samsung
Cap Ceramic 2.2uF 25V X7R 10% SMD 1206 125C Embossed T/R
CL31B225KAHNNNE.pdf36 Pages, 1335 KB, Original
CL31B225KAHNNNE
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 1206 125C Low ESR T/R
CL31B225KAHNNNF.pdf2 Pages, 134 KB, Original
CL31B225KAHNNNF
Samsung
Cap Ceramic 2.2uF 25V X7R 10% SMD 1206 125C Embossed T/R
CL31B225KBH4PNE.pdf36 Pages, 1278 KB, Original
CL31B225KBH4PNE
Samsung
Cap Ceramic 2.2uF 50V X7R 10% Pad SMD 1206 Soft Termination 125C Automotive T/R
CL31B225KBHNFNE.pdf36 Pages, 1335 KB, Original
CL31B225KBHNFNE
Samsung
Cap Ceramic 2.2uF 50V X7R 10% Pad SMD 1206 125C T/R
CL31B225KBHNNNE.pdf36 Pages, 1335 KB, Original
CL31B225KBHNNNE
Samsung
Cap Ceramic 2.2uF 50V X7R 10% Pad SMD 1206 125C Low ESR T/R
CL31B225KBHNNNF.pdf36 Pages, 1424 KB, Original
CL31B225KBHNNNF
Samsung
Cap Ceramic 2.2uF 50V X7R 10% Pad SMD 1206 125C T/R
CL31B225KBHVPNE.pdf36 Pages, 1278 KB, Original
CL31B225KBHVPNE
Samsung
Cap Ceramic 2.2uF 50V X7R 10% Pad SMD 1206 Soft Termination 125C Automotive T/R
CL31B225KCHSFNE.pdf36 Pages, 1335 KB, Original
CL31B225KCHSFNE
Samsung
Cap Ceramic 2.2uF 100V X7R 10% Pad SMD 1206 125C T/R
CL31B225KCHSNNE.pdf36 Pages, 1335 KB, Original
CL31B225KCHSNNE
Samsung
Cap Ceramic 2.2uF 100V X7R 10% Pad SMD 1206 125C Low ESR T/R
CL31B225KOH4PNE.pdf3 Pages, 173 KB, Original
CL31B225KOH4PNE
Samsung
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 1206 125C Automotive T/R
CL31B225KOHNFNE.pdf36 Pages, 1335 KB, Original
CL31B225KOHNFNE
Samsung
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 1206 125C T/R

Product Details Search Results:

Samsung.com/CL31B225KAH4PNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Product Height (mm)":"1.6 mm","Case Style":"Ceramic Chip","Rad Hardened":"No","Product Length (mm)":"3.2 mm","Mounting Style":"Surface Mount","Capacitance":"2200000 pF","Operating Temp Range":"-55C to 125C","Construction":"SMT Chip","Product Diameter (mm)":"Not Required mm","Voltage":"25VDC","Package / Case":"1206","Product Depth (mm)":"1.6 mm","Tolerance (+ or -)":"10%","Temp Coeff (Dielectric)":"X7R","Wire Form":"Not Required"}...
1573 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KAHNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000PF(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number...
1756 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KAHNNNF
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Product Height (mm)":"1.6 mm","Case Style":"Ceramic Chip","Rad Hardened":"No","Product Length (mm)":"3.2 mm","Mounting Style":"Surface Mount","Capacitance":"2200000 pF","Operating Temp Range":"-55C to 125C","Construction":"SMT Chip","Product Diameter (mm)":"Not Required mm","Voltage":"25VDC","Package / Case":"1206","Product Depth (mm)":"1.6 mm","Tolerance (+ or -)":"10%","Temp Coeff (Dielectric)":"X7R","Wire Form":"Not Required"}...
1546 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KBH4PNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of...
1781 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KBHNFNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of...
1748 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KBHNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000PF(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number...
1756 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KBHNNNF
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000PF(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number...
1753 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KBHVPNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of...
1784 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KCHSFNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of...
1745 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KCHSNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000PF(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number...
1760 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KOH4PNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of...
1745 Bytes - 10:18:37, 29 April 2025
Samsung.com/CL31B225KOHNFNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of...
1747 Bytes - 10:18:37, 29 April 2025

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