Datasheet.Directory

{"Category":"Integrated Circuits (ICs)","Package / Case":"44-TQFP","Peripherals":"POR, WDT","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Voltage - Supply (Vcc/Vdd)":"2.7 V ~ 5.5 V","Program Memory Size":"12KB (12K x 8)","RAM Size":"256 x 8","Packaging":"Tray","Product Photos":"44-TQFP","Program Memory Type":"FLASH","PCN Design/Specification":"Copper Bonding Wire 17/Oct/2013","Product Training Modules":"MCU Product Line Introduction Software Framework (ASF) Example of Use Studio Introduction to Software...

{"Mounting":"Surface Mount","Total Internal Ram Size":"256B(kB)","Program Memory Size":"12KB(kB)","Programmable":"Yes","Operating Temperature (Min)":"-40C","Operating Temperature (Max)":"85C","Program Memory Type":"Flash","Operating Temperature Classification":"INDUSTRIALC","Package Type":"TQFP","Clock Freq":"24(MHz)","Operating Supply Voltage (Max)":"5.5(V)","Cpu Family":"AT89","Operating Supply Voltage (Min)":"2.7(V)","Device Core":"8051","Operating Temp Range":"-40C to 85C","Interface Type":"SPI/UART","I...